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MC74VHC393

Dual 4-Bit Binary Ripple Counter

ON Semiconductor 

MC74VHC393

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MAXIMUM RATINGS*

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol

Parameter

Value

Unit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VIN

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VOUT

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ IIK

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ IOK

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ IOUT

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ICC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ PD

DC Supply Voltage

–0.5 to + 7.0

V

DC Input Voltage

–0.5 to + 7.0

V

DC Output Voltage

Input Diode Current

–0.5 to VCC + 0.5 V

–20

mA

Output Diode Current

±20

mA

DC Output Current, per Pin

±25

mA

DC Supply Current, VCC and GND Pins

±75

mA

Power Dissipation in Still Air,

SOIC Packages†

500

mW

TSSOP Package†

450

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Tstg Storage Temperature

–65 to + 150

°C

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ * Absolute maximum continuous ratings are those values beyond which damage to the device

may occur. Exposure to these conditions or conditions beyond those indicated may

adversely affect device reliability. Functional operation under absolute–maximum–rated

conditions is not implied.

†Derating — SOIC Packages: – 7 mW/°C from 65° to 125°C

TSSOP Package: – 6.1 mW/°C from 65° to 125°C

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high–impedance cir-

cuit. For proper operation, Vin and

Vout should be constrained to the

range GND v (Vin or Vout) v VCC.

Unused inputs must always be

tied to an appropriate logic voltage

level (e.g., either GND or VCC).

Unused outputs must be left open.

ÎÎÎÎÎÎÎÎRÎÎÎÎÎÎÎÎSEVyCVtVmTOÎÎrÎÎÎÎÎÎ,COIAUNtbCfTMoÎÎÎÎÎÎÎÎlMEÎDDDOIÎÎÎÎÎÎÎNnCCCppDeuSIOEÎrtnÎÎÎÎÎÎÎauRuDptptiuinpsptOÎgueÎÎÎÎÎÎÎlVytPTaoVVeEnltooÎmdaÎÎÎÎÎÎÎRllttgpaFaAeeggaTÎreeÎÎÎÎÎÎÎlalItTNuimrGÎeÎÎÎÎÎÎÎeCOÎÎÎÎÎÎÎÎNDÎÎÎÎÎÎÎÎITIOÎÎÎÎÎÎÎÎNSÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎPaVVrCCÎaÎÎÎÎÎÎÎCCm==eÎÎÎÎÎÎÎÎt35e..r30ÎVVÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎM–2ÎÎÎÎÎÎÎÎ00005.i0n5 ÎÎÎÎÎÎÎÎ+MV15521ÎÎÎÎÎÎÎÎ0C..a02550Cx5 ÎÎÎÎÎÎÎÎnU°sVVVnC/ÎÎÎÎÎÎÎÎVit

The qJA of the package is equal to 1/Derating. Higher junction temperatures may affect the expected lifetime of the device per the table and

figure below.

DEVICE JUNCTION TEMPERATURE VERSUS

TIME TO 0.1% BOND FAILURES

Junction

Temperature °C

80

90

100

110

120

130

140

Time, Hours

1,032,200

419,300

178,700

79,600

37,000

17,800

8,900

Time, Years

117.8

47.9

20.4

9.4

4.2

2.0

1.0

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

1

1

10

100

1000

TIME, YEARS

Figure 5. Failure Rate vs. Time Junction Temperature

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