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MC74HC373A

Octal 3−State Non−Inverting Transparent Latch

ON Semiconductor 

MC74HC373A

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MAXIMUM RATINGS

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol

Parameter

Value

Unit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VCC DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Vin DC Input Voltage (Referenced to GND)

– 0.5 to VCC + 0.5 V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Vout DC Output Voltage (Referenced to GND)

– 0.5 to VCC + 0.5 V

Iin

DC Input Current, per Pin

± 20

mA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Iout DC Output Current, per Pin

± 35

mA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ICC DC Supply Current, VCC and GND Pins

± 75

mA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ PD Power Dissipation in Still Air,

Plastic DIP†

750

mW

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SOIC Package†

500

TSSOP Package†

450

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Tstg Storage Temperature

– 65 to + 150

_C

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

cuit. For proper operation, Vin and

Vout should be constrained to the

range GND v (Vin or Vout) v VCC.

Unused inputs must always be

tied to an appropriate logic voltage

level (e.g., either GND or VCC).

Unused outputs must be left open.

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ TL Lead Temperature, 1 mm from Case for 10 Seconds

_C

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (Plastic DIP, SOIC, SSOP or TSSOP Package)

260

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

SOIC Package: – 7 mW/_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min Max Unit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VCC DC Supply Voltage (Referenced to GND)

2.0

6.0

V

Vin, Vout DC Input Voltage, Output Voltage (Referenced to GND)

0

VCC

V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ TA

Operating Temperature, All Package Types

– 55 + 125 _C

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ tr, tf Input Rise and Fall Time

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (Figure 1)

VCC = 2.0 V 0

VCC = 4.5 V 0

VCC = 6.0 V 0

1000 ns

500

400

ORDERING INFORMATION

Device

Package

MC74HC373AN

PDIP−20

MC74HC373ANG

PDIP−20

(Pb−Free)

Shipping†

18 Units / Box

18 Units / Box

MC74HC373ADW

MC74HC373ADWG

SOIC−20 WIDE

SOIC−20 WIDE

(Pb−Free)

38 Units / Rail

38 Units / Rail

MC74HC373ADWR2

MC74HC373ADWR2G

MC74HC373ADT

MC74HC373ADTG

MC74HC373ADTR2

MC74HC373ADTR2G

MC74HC373AF

MC74HC373AFG

SOIC−20 WIDE

SOIC−20 WIDE

(Pb−Free)

TSSOP−20*

TSSOP−20*

TSSOP−20*

TSSOP−20*

SOEIAJ−20

SOEIAJ−20

(Pb−Free)

1000 Units / Reel

1000 Units / Reel

75 Units / Rail

75 Units / Rail

2500 Units / Reel

2500 Units / Reel

40 Units / Rail

40 Units / Rail

MC74HC373AFEL

SOEIAJ−20

2000 Units / Reel

MC74HC373AFELG

SOEIAJ−20

(Pb−Free)

2000 Units / Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*This package is inherently Pb−Free.

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