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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

EUA6011AQIT1 데이터 시트보기 (PDF) - Eutech Microelectronics Inc

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EUA6011AQIT1 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Package Information
EUA6011A
Use as much
copper area
as possible
Bottom view
Exposed Pad
NOTE
1. Package body sizes exclude mold flash protrusion or gate burrs
2. Tolerance ± 0.1mm unless otherwise specified
3. Coplanarity :0.1mm
4. Controlling dimension is millimeter.
5. Die pad exposure size is according to lead frame design.
6. Standard Solder Map dimension is millimeter.
7. Followed from JEDEC MO-15
SYMBOLS
A
A1
A2
b
C
D
E
E1
e
L
y
θ
DIMENSIONS IN MILLIMETERS
MIN.
NOM.
MAX.
------
------
1.15
0.00
------
0.10
0.80
1.00
1.05
0.19
------
0.30
0.09
------
0.20
7.70
7.80
7.90
------
6.40
-----
4.30
4.40
4.50
------
0.65
-----
0.45
0.60
0.75
------
------
0.10
0
------
8
DIMENSIONS IN INCHES
MIN.
NOM.
MAX.
------
------
0.045
0.000
------
0.004
0.031
0.039
0.041
0.007
------
0.012
0.004
------
0.008
0.303
0.307
0.311
------
0.252
------
0.169
0.173
0.177
------
0.026
------
0.018
0.024
0.030
------
------
0.004
0
------
8
DS6011A Ver 1.0 Mar. 2006
20

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