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AD1981BL 데이터 시트보기 (PDF) - Analog Devices

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AD1981BL
ADI
Analog Devices ADI
AD1981BL Datasheet PDF : 32 Pages
First Prev 31 32
AD1981BL
OUTLINE DIMENSIONS
0.75
0.60
0.45
1.60
MAX
48
1
9.00 BSC
SQ
PIN 1
1.45
1.40
1.35
0.15
0.05
SEATING
PLANE
0.20
0.09
3.5°
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90° CCW
TOP VIEW
(PINS DOWN)
12
13
VIEW A 0.50
BSC
LEAD PITCH
COMPLIANT TO JEDEC STANDARDS MS-026BBC
Figure 10. 48-Lead Low Profile Quad Flat Package [LQFP]
(ST-48)
Dimensions shown in millimeters
37
36
7.00
BSC SQ
25
24
0.27
0.22
0.17
ORDERING GUIDE
Model
AD1981BLJST
AD1981BLJST-REEL
AD1981BLJSTZ1
AD1981BLJSTZ-REEL1
Temperature Range
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
Package Description
48-Lead Low Profile Quad Flat Package [LQFP]
48-Lead Low Profile Quad Flat Package [LQFP]
48-Lead Low Profile Quad Flat Package [LQFP]
48-Lead Low Profile Quad Flat Package [LQFP]
Package Option
ST-48
ST-48
ST-48
ST-48
1Z = Pb-free part. The AD1981BLJSTZ is a lead-free environmentally friendly product. It is manufactured using the most up-to-date materials and processes. The coating
on the leads of each device is 100% pure tin electroplate. The device is suitable for lead-free applications and can withstand surface-mount soldering at up to 255°C
(±5°C). In addition, it is backward compatible with conventional tin-lead soldering processes. This means that the electroplated tin coating can be soldered with tin-
lead solder pastes at reflow temperatures of 220°C to 235°C.
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04321–0–1/05(A)
Rev. A | Page 32 of 32

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