ADP2105 데이터 시트보기 (PDF) - Analog Devices
부품명
상세내역
일치하는 목록
ADP2105 Datasheet PDF : 36 Pages
| |||
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
IN, EN, SS, COMP, FB to AGND
LX1, LX2 to PGND
PWIN1, PWIN2 to PGND
PGND to AGND
GND to AGND
PWIN1, PWIN2 to IN
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
−0.3 V to +6 V
−0.3 V to (VIN + 0.3 V)
−0.3 V to +6 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ADP2105/ADP2106/ADP2107
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
16-Lead LFCSP
40
Maximum Power Dissipation
1
Unit
°C/W
W
BOUNDARY CONDITION
Natural convection, 4-layer board, exposed pad soldered to the PCB.
ESD CAUTION
Rev. E | Page 7 of 36
Share Link: 