ESDASCY(2012) 데이터 시트보기 (PDF) - STMicroelectronics
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ESDASCY Datasheet PDF : 12 Pages
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Recommendation on PCB assembly
ESDASCY
5.3
PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
5.4
Reflow profile
Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
0
30
60
90
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
120 150 180 210 240 270 300
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
10/12
Doc ID 022084 Rev 1
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