NTCS0805E3103FHT 데이터 시트보기 (PDF) - Vishay Semiconductors
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NTCS0805E3103FHT Datasheet PDF : 8 Pages
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NTCS0805E3.....T
Vishay BCcomponents
SMD 0805, Glass Protected
NTC Thermistors
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
300
260 °C
250 245 °C
200 215 °C
180 °C
150
130 °C
100
50
Reflow Soldering
2 K/s
10 s
10 s
40 s
0
0
50
100
150
200
250
Time (s)
Lead (Pb)-free Reflow Soldering Profile
300
260 °C
250 ≈ 245 °C
235 °C
200
≈ 170 °C
150
≈ 120 °C
100
2 K/s
50
max.
0
0
50 100 150 200
40 s max.
20 s min.
≈ 60 s
6 K/s
max.
limit
normal
250 300 350
Time (s)
Dimensions of the solder lands
1.0
1.3
3.0
TESTS AND REQUIREMENTS
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
TEST METHOD
TEST
PROCEDURE
Solderability
2 s at 235 °C
6
TC
Resistance to soldering heat
10 s at 260 °C
REQUIREMENTS
Min. 95 % of surface wetted
R/R < 5 %
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
P0
D0
P2
B0
A0
P1
T
E1
F
W
JWB288
T1
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A0 (1)
B0 (1)
W
E1
F
D0
P0 (2)
P1
P2
T tape thickness
T1 cover tape
DIMENSION
1.7
2.35
8.0
1.75
3.5
1.55
4.0
4.0
2.0
1.1
< 0.1
TOLERANCE
± 0.2
± 0.1
± 0.2
± 0.1
± 0.05
± 0.05
± 0.1
± 0.1
± 0.05
Max.
-
Notes
(1) Measured 0.3 mm above base pocket
(2) P0 pitch cumulative error over any 10 pitches ± 1.0 mm
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For technical questions, contact: nlr@vishay.com
Document Number: 29044
Revision: 09-Mar-11
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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