XU1003 데이터 시트보기 (PDF) - Mimix Broadband
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XU1003 Datasheet PDF : 7 Pages
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19.0-26.0 GHz GaAs MMIC
Transmitter
June 2005 - Rev 21-Jun-05
Mechanical Drawing
1.945
(0.077)
1.608
(0.063)
1
1.678
(0.066)
2
2.478
(0.098)
3
3.278
(0.129)
4
U1003
5
1.487
(0.059)
10
9
87
6
0.0
0.0
1.678
(0.066)
2.478
(0.098)
3.077 3.278 3.677 3.970
(0.121) (0.129) (0.145) (0.156)
(Note: Engineering designator is 22TX0523)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.787 mg.
Bond Pad #1 (RF Out) Bond Pad #3 (IF1)
Bond Pad #2 (Vd1) Bond Pad #4 (Vd2)
Bias Arrangement
Vd1
IF1
2
3
Bond Pad #5 (LO)
Bond Pad #7 (Vg2) Bond Pad #9 (IF2)
Bond Pad #6 (Vg2b) Bond Pad #8 (Vg2a) Bond Pad #10 (Vg1)
Bypass Capacitors - See App Note [2]
Vd2
Vd2
Vd1
IF1
4
RF 1
RF
5 LO
LO
XU1003
Vg1
10
9
87
6
IF2
Vg2
IF2
Vg1
Vg2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 7
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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