XC6221A451GR 데이터 시트보기 (PDF) - TOREX SEMICONDUCTOR
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XC6221A451GR
TOREX SEMICONDUCTOR
XC6221A451GR Datasheet PDF : 28 Pages
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■PACKAGING INFORMATION (Continued)
● SSOT-24 Power Dissipation
Power dissipation data for the SSOT-24 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
XC6221
Series
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40×40mm（1600mm2 in one side）
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material : Glass Epoxy（FR-4）
Thickness : 1.6mm
Through-hole : 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature (℃)
25
85
Power Dissipation Pd (mW)
500
200
Thermal Resistance (℃/W）
200.00
600
500
400
300
200
100
0
25
Pd vs Ta
45
65
85
105
125
Ambient Temperature Ta（℃）
23/28
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