VN808CM 데이터 시트보기 (PDF) - STMicroelectronics
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VN808CM Datasheet PDF : 14 Pages
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Mechanical Data
VN808CM
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com
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