UPG100P 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPG100P

WIDE BAND AMPLIFIER CHIPS

NEC => Renesas Technology 

PPG100P, PPG101P

RECOMMENDED CHIP ASSEMBLY CONDITIONS

Die Attachment

Atmosphere

: N2 gas

Temperature

: 320 r5 °C

AuSn Preform

: 0.5 u 0.5 u 0.05t (mm), 2 pcs.

* The hard solder such as AuSi or AuGe which has higher melting point than

AuSn should not be used.

Base Material

: CuW, Cu, KV

* Other material should not be used.

Epoxy Die Attach is not recommended.

Bonding

Machine

Wire

Temperature

Strength

Atmosphere

: TCB

* USB is not recommended

: 30 Pm diameter Au wire

: 260 r5 °C

: 31 r3 g

: N2 gas

QUALITY ASSURANCE (Refer to GET-30116)

1. 100 % Tests

1-1 100 % DC and RF Probe

1-2 Visual Inspection

MIL-STD-883/Method 2010 Condition B

2. Tests on Sampling Basis

2-1 Bond Pull Tests (In case of recommended chip handling)

MIL-STD-883 Method 2011

5 samples/wafer and 20 points tested

Accept 0/Reject 1

2-2 Tests in Standard Package

Test the electrical characteristics of chips assembled into the standard package used for PPG100B and

PPG101B.

5 samples/wafer tested

DC and RF measurement Accept 1/Reject 2

3. WARRANTEE

NEC has a responsibility of quality assurance for the products within 180 days after delivered to customers where

these are handled properly and stored in the desicater with the flow of dry N2 gas.

4. CAUTION

4-1 Take great care to prevent static electricity.

4-2 Be sure that Die Attach is performed in N2 atmosphere.

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