5 2. PIN CONFIGURATION (PAD LAYOUT)
Chip size: 16800 x 3060 µm2
Bump size (output): 33 x 60 µm2
Bump size (input & dummy): 87 x 60 µm2
Alignment Mark
X: –7806.06 Y: 858.24
X: 7783.83 Y: –914.43
389
390
338 outputs
Chip surface
(Bump side)
Y(-
X(+
Output side
438
439
Input side
60 um
72 um
72 um
72 um
60 um
72 um
µ PD161620
50
49
1
552
Preliminary Product Information S14797EJ3V7PM
3