HMMC-2027 데이터 시트보기 (PDF) - HP => Agilent Technologies
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HMMC-2027 Datasheet PDF : 6 Pages
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70
740
RF
OUT2
375
525
SEL1
SEL2
830 900
960
RF
OUT1
740
RF
IN
CHIP ID
70
0
0
450
Figure 8. HMMC-2027 Bonding Pad Locations. (Dimensions in micrometers)
Note:
All compression data measured in an individual device mounted in an HP83040
Series Modular Microcircuit Package @ Tcase = 25°C.
This data sheet contains a variety of typical and guaranteed performance data. The
information supplied should not be interpreted as a complete list of circuit specifica-
tions. In this data sheet the term typical refers to the 50th percentile performance. For
additional information contact your local HP sales representative.
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