UJA1066TW 데이터 시트보기 (PDF) - NXP Semiconductors.
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UJA1066TW Datasheet PDF : 70 Pages
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NXP Semiconductors
UJA1066
High-speed CAN fail-safe system basis chip
3. Ordering information
Table 1. Ordering information
Type number[1] Package
Name
UJA1066TW
HTSSOP32
Description
Version
plastic thermal enhanced thin shrink small outline package; 32 leads; SOT549-1
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
[1] UJA1066TW/5V0 is for the 5 V version; UJA1066TW/3V3 is for the 3.3 V version.
4. Block diagram
31
SENSE
32
BAT42
BAT14 27
SYSINH 29
30
V3
17
INH/LIMP
INH
INTN
WAKE
TEST
SCK
SDI
SDO
SCS
7
18
WAKE
16
CHIP
TEMPERATURE
11
9
10
SPI
12
BAT
MONITOR
V1
V2
UJA1066
4 V1
20
V2
SBC
FAIL-SAFE
SYSTEM
V1 MONITOR
RESET/EN
WATCHDOG
6
RSTN
8 EN
OSCILLATOR
GND SHIFT
DETECTOR
23
GND
Fig 1. Block diagram
BAT42
V2
HIGH
SPEED
CAN
24
SPLIT
21
CANH
22 CANL
13
TXDC
14
RXDC
001aag303
UJA1066_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 17 March 2010
© NXP B.V. 2010. All rights reserved.
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