TZA3047B 데이터 시트보기 (PDF) - Philips Electronics

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TZA3047B

30 Mbits/s up to 1.25 Gbits/s laser drivers

Philips Electronics 

Philips Semiconductors

30 Mbits/s up to 1.25 Gbits/s laser drivers

Product specification

TZA3047A; TZA3047B

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to ground; positive

currents flow into the IC.

SYMBOL

PARAMETER

CONDITION

MIN.

VCCD

VCCA

VCCO

digital supply voltage

analog supply voltage

output stage supply voltage

−0.5

−0.5

3.3 V laser supply

−0.5

5 V laser supply (TZA3047B only) −0.5

Vo(LA)

output voltage at pin LA

TZA3047A; VCCO = 3.3 V

1.2

TZA3047B; VCCO = 3.3 V

0.8

TZA3047B; VCCO = 5 V

1.2

Vo(LAQ) output voltage at pin LAQ

TZA3047A; VCCO = 3.3 V

1.8

TZA3047B; VCCO = 3.3 V

1.6

TZA3047B; VCCO = 5 V

2.0

VBIAS

bias voltage

TZA3047A; VCCO = 3.3 V

0.4

TZA3047B; VCCO = 3.3 V

0.4

TZA3047B; VCCO = 5 V

0.8

Vn

voltage on other input and output

pins

analog inputs and outputs

−0.5

digital inputs and outputs

−0.5

In

input current on pins

MAXOP, MAXMON, RREF, PWA,

−1.0

ER and AVR

VTEMP, BIASOUT and MODOUT

−1.0

ALOP, ALMON and MON

0

Tamb

ambient temperature

−40

Tj

junction temperature

−40

Tstg

storage temperature

−65

MAX.

+3.5

+3.5

+3.5

+5.3

4.5

4.1

4.5

4.5

4.5

5.2

3.6

3.6

4.1

VCCA + 0.5

VCCD + 0.5

0

+1.0

5.0

+85

+125

+150

UNIT

V

V

V

V

V

V

V

V

V

V

V

V

V

V

V

mA

mA

mA

°C

°C

°C

9 THERMAL CHARACTERISTICS

In compliance with JEDEC standards JESD51-5 and JESD51-7.

SYMBOL

PARAMETER

CONDITIONS

Rth(j-a)

thermal resistance from junction to

ambient

4 layer printed circuit board in still

air with 9 plated vias connected

with the heatsink and the first

ground plane in the PCB

HBCC32 die pad soldered to

PCB

VALUE

35

60

UNIT

K/W

K/W

2003 Jun 05

9

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