DF-M
1.0 Amp. Miniature Glass Passivated Single-Phase Bridge Rectifier
DFM
Voltage
200 V to 1000 V
Current
1.0 Amp. at 40ºC
FEATURES
Ideal for automated insertion
High forward surge current capability
Ideal for printed circuit boards
Solder dip 260ºC, 10s
Component in accordance to RoHS 2011/65/EU
and WEEE 2002/96/EC
Meets MSL level 1, per J-STD-020, LF maximum
peak of 250º C
MECHANICAL DATA
Case: DFM
Epoxy meets UL 94V-0 flammability rating.
Polarity: As marked on body.
Terminals: Matte tin plated leads, solderable per
MIL-STD-750 Method 2026, J-STD-002 and JESD22-B102.
Consumer grade, meets JESD 201 class 1A whisker test.
TYPICAL APPLICATIONS
Used in ac-to-dc bridge full wave rectification for SMPS,
lighting ballaster, adapter, battery charger, home appliances, office
equipment, and telecommunication applications..
Maximun Ratings and Electrical Characteristics at 25°C
DF02M DF04M DF06M DF08M
VRRM
VRMS
VR
IF (AV)
IF RM
IFSM
I2t
Tj
Tstg
Marking code
Peak recurrent reverse voltage (V)
Maximum RMS voltage (V)
Recommended Input Voltage (V)
Forward current at Tamb = 40 °C
R Load
L Load
Recurrent peak forward current
8.3 ms. peak forward surge current
(Jedec Method)
I2t value for fusing (t = 8.3 ms)
Operating temperature range
Storage temperature range
DF02M
200
140
80
DF04M
400
280
125
DF06M
600
420
250
1.0 A
0.8 A
10 A
DF08M
800
560
380
50 A
10 A2sec
55 to + 150 °C
55 to + 150 °C
DF10M
DF10M
1000
700
500
Electrical Characteristics at Tamb = 25 °C
VF Max. forward voltage drop at IF = 1 A
IR
Max. reverse current per
element VRRM d.c.
and Ta = 25 °C
and Ta = 125 °C
Rth(j-a) Maximum thermal resistance junction to ambient (*)
(*) NOTE: Thermal Resistance from junction to ambient mounted on P.C. Board with 13 mm. sq. Copper Pads
1.1 V
10 µA
500 µA
65 °C/W
www.fagorelectronica.com
Document Name: dfm
Version: Dec-11
Page Number: 1/4