TSL260RD 데이터 시트보기 (PDF) - Unspecified
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TSL260RD Datasheet PDF : 12 Pages
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TSL250RD, TSL251RD, TSL260RD, TSL261RD
LIGHT-TO-VOLTAGE OPTICAL SENSORS
MANUFACTURING INFORMATION
TAOS050K − OCTOBER 2007
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered
to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The component should
be limited to a maximum of three passes through this solder reflow profile.
Table 1. TSL2xxRD Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above Tpeak −10°C
Peak temperature in reflow
Temperature gradient in cooling
REFERENCE
tsoak
t1
t2
t3
Tpeak
TSL2xxRD
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260° C (−0°C/+5°C)
Max −5°C/sec
Tpeak
T3
T2
T1
Not to scale — for reference only
Time (sec)
t3
t2
tsoak
t1
Figure 12. TSL2xxRD Solder Reflow Profile Graph
The LUMENOLOGY r Company
r
r
www.taosinc.com
Copyright E 2007, TAOS Inc.
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