TA8429H 데이터 시트보기 (PDF) - Toshiba
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TA8429H Datasheet PDF : 14 Pages
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TA8429H/HQ
TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic
TA8429H, TA8429HQ
Full-bridge Driver (H-Switch) for DC Motor
(Driver for Switching between Forward and Reverse Rotation)
The TA8429H/HQ is a full-bridge driver IC for brush motor
rotation control. Four operating modes are selectable from
forward, reverse, stop and brake.
The TA8429H/HQ is best suited to drive medium-sized DC and
bipolar stepping motors.
Since the motor drive section and control section have separate
power supply pins, the TA8429H/HQ also allows servo control.
Features
Weight : 4.04 g (typ.)
z Output current of up to 3.0 A (AVE.) and 4.5 A (PEAK)
z Four different modes (forward rotation, reverse rotation, stop, and brake) are supported.
A counter-electromotive force absorber diode is also incorporated.
z Stand-by mode available: IST ≤ 100 μA
z Built-in thermal shutdown and short circuit protection circuits
z HZIP power package sealed
z Wide range of operating voltage: VCC = 7 to 27 V
VS = 0 to 27 V
*Please consider the internal loss (Vsat) to operate the IC though minimum VS
is defined zero.
Terminals of TA8429 written below are sensitive to electrostatic discharge. When handling this product, ensure that
the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an
ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels.
Terminals which are sensitive to electrostatic discharge: No. 1, 2, and 12.
The IC should be installed correctly. Otherwise, the IC or peripheral parts and devices may be degraded or
permanently damaged.
The TA8429HQ is a Sn-plated product. (The Pb-containing
materials with a high melting point that are exempted from RoHS
directives are used inside the IC.)
The following conditions apply to solderability:
*Solderability
1. Use of Sn-37Pb solder bath
*solder bath temperature = 230°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245°C
*dipping time = 5 seconds
*the number of times = once
*use of R-type flux
1
2010-02-23
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