ST7773 데이터 시트보기 (PDF) - Sitronix Technology Co., Ltd.
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ST7773 Datasheet PDF : 128 Pages
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ST7773
3. Pad arrangement
G220
G216
G218
G214
G6
G2
G8
G4
S528
S526
S527
S525
S3
S1
S4
S2
G1
G5
G3
G7
G215
G219
G213
G217
VCOM
VCOM
VCOM
VCOM
VCOM
VCOM
VREF
C23N
C23N
C23N
C23P
C23P
C23P
C22N
C22N
C22N
C22P
C22P
C22P
VGH
VGH
VGH(O)
VGL
VGL
VGL
VCOML
VCOML
VCOML
VCOML
VCOMH
VCOMH
VCOMH
VCOMH
VCL
VCL
VCL
VCL(O)
C21N
C21N
C21N
C21P
C21P
C21P
VCI1
VCI1
VCI1
VCI1
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AVDD
AVDD
AVDD
AVDD
AVDD(O)
AVDD(O)
AVDD(O)
AVDD(O)
C12N
C12N
C12N
C12N
C12P
C12P
C12P
C12P
C11N
C11N
C11N
C11N
C11P
C11P
C11P
C11P
GVDD
GVDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VCC(O)
VCC
VCC
VCC
VCC
VDDI
VDDI
VDDI
VDDI
VDDI
VDDI
VDDI
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
TEST
TEST
TEST
DGNDO
TEST
DGNDO
D/CX(SCI)
DGNDO
RESX
TEST
TEST
WRX
RDX
CSX
TE
OSC
DGNDO
VDDIO
D0(SDA)
D1
D2
D3
D4
D5
D6
D7
D8
DGNDO
D9
D10
D11
D12
D13
D14
D15
D16
D17
TEST
TPO[7]
TPO[6]
TPO[5]
TPO[4]
TPO[3]
TPO[2]
TPO[1]
TPO[0]
TPI[3]
TPI[2]
TPI[1]
TPI[0]
VDDIO
DGNDO
VDDIO
TEST
TEST
DGNDO
TEST
TEST
TEST
TEST
TEST
VDDIO
SMY
SMX
SRGB
DGNDO
TEST
TEST
VDDIO
TEST
DGNDO
AUTO
TEST
TEST
IM2
IM1
IM0
VDDIO
EXTC
DUMMYA
Ver. 2.0
View point: bump view
Chip size (um): 17370x820
PAD coordinate: pad center
Coordinate origin: chip center
Chip thickness (um): 300(typical)
Bump height (um): 15(typical)
Bump hardness (HV): 75(typical)
Pad arrangement (Unit: um):
Output: pad No. 1 ~ 751 = 18 x 96
Input: pad No. 752 ~ 947 = 50 x 96
70
96
50
50
Alignment mark (unit: um):
Left align mark (-8120.58,-300)
Left align mark ( 8080.6,-300)
30 40 30
Alignment mark
2
2008-07-07
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