ST7732
3. Pad arrangement
View point: bump view
Chip size (um): 13500 x 700
PAD coordinate: pad center
Coordinate origin: chip center
Chip thickness (um): 300±15
Bump height (um): 15±3
Bump hardness (HV): 75±25
Pad arrangement (Unit: um):
Output: pad No. 1 ~ 585 = 21 x 96
21 23
96
22
35
96
Input: pad No. 586 ~ 760 = 55 x 96
Alignment mark (unit: um):
(-6627.5, -195.5)
(6627.5, -195.5)
Ver 1.5.2
3
2007-12