ST7715
3.3 Alignment Mark Dimension
10 5
5 10
15 15 20 15 15
80
3.4 Chip Information
Chip size (um x um): 9900 x 670
PAD coordinate: pad center
Coordinate origin: chip center
Chip thickness (um): 300 (TYP)
Bump height (um): 15 (TYP)
Bump hardness (HV): 75 (TYP)
15 15 20 15 15
80
V1.5
4
2009-12-04