ST7588TI 데이터 시트보기 (PDF) - Sitronix Technology Co., Ltd.

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ST7588TI

81 x 132 Dot Matrix LCD Controller/Driver

Sitronix Technology Co., Ltd. 

ST7588T

n PAD ARRANGEMENT (COG)

Chip Size: 7,708 μm × 980 μm

Bump Pitch: (minimum)

PAD NO 1~185, 248~276: 45μm (COM/SEG)

PAD NO 186~187, 188~189, 191~192, 193~194, 195~196, 197~198, 199~200, 201~202, 213~214,215~216: 119μm

PAD NO 187~188, 189~190, 192~193, 194~195, 196~197, 198~199, 200~201, 209~211, 212~213, 214~215, 216~217,

218~220: 73μm

PAD NO 190~191: 134μm; PAD NO 202~203: 77μm; PAD NO 204~205, 206~207: 75μm

PAD NO 203~204, 205~206: 175μm; PAD NO 207~208: 150μm; PAD NO 211~212, 217~218: 102μm

PAD NO 220~221: 93μm; PAD NO 208~209: 68μm; PAD NO 221~243, 244~247: 70μm PAD NO 243~244: 145μm

Bump Size:

PAD NO 1~156, 174~185, 248~259: 30(x) μm × 80(y) μm

PAD NO 157~173, 260~276: 80(x) μm × 30(y) μm

PAD NO 186~202, 209~247: 55(x) μm × 60(y) μm

PAD NO 203~208: 45(x) μm × 60(y) μm

Bump Height: 17 μm

Chip Thickness: 480 μm

Ver 1.3

2/61

2007/09/20

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