ST7571 데이터 시트보기 (PDF) - Sitronix Technology Co., Ltd.

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ST7571

4 Gray Scale DotMatrix LCD Controller/Driver

Sitronix Technology Co., Ltd. 

ST7571

3. PAD ARRANGEMENT (COG)

l Chip Size : 7956um X 780um

l Bump Pitch :

I/O PAD : 80um

COM PAD : 33um

SEG PAD : 27um

l Bump Size :

I/O PAD : 65um X 63 um

COM/SEG PAD : 14um X 128um

l Bump Height : 15um

l Chip Thickness : 300 um

Ver 1.5a

Fig. 1 IC Pad Arrangement

2/76

2009/7/21

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