SS26 데이터 시트보기 (PDF) - ON Semiconductor
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SS26 Datasheet PDF : 4 Pages
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SS26
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance − Junction−to−Lead (Note 1)
Thermal Resistance − Junction−to−Ambient (Note 2)
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
Maximum Instantaneous Reverse Current (Note 3)
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
(iF = 1.0 A)
(iF = 2.0 A)
(VR = 60 V)
Symbol
RqJL
RqJA
Symbol
vF
IR
Value
24
80
Value
TJ = 25°C
TJ = 125°C
0.51
0.475
0.63
0.55
0.2
10
Unit
°C/W
Unit
V
mA
10
10
125°C
75°C
25°C
1
1
125°C
75°C
25°C
0.1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
0.1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 2. Maximum Forward Voltage
1.0E−02
1.0E−03
1.0E−04
1.0E−05
1.0E−06
1.0E−07
0
125°C
75°C
25°C
10
20
30
40
50
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
100
10
60
0
25°C
f = 1 MHz
10
20
30
40
50
60
VR, REVERSE VOLTAGE (V)
Figure 4. Typical Capacitance
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