CXA3174N 데이터 시트보기 (PDF) - Sony Semiconductor

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CXA3174N

AGC IF for GSM/PCS

Sony Semiconductor 

Package Outline Unit : mm

CXA3174N

20PIN SSOP (PLASTIC)

∗6.5 ± 0.1

20

11

A

+ 0.2

1.25 – 0.1

0.1

1

10

0.65

b

0.13 M

0.1 ± 0.1

+ 0.1

b=0.22 – 0.05

(0.22)

b=0.22 ± 0.03

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

SSOP-20P-L01

SSOP020-P-0044

DETAIL B : SOLDER

DETAIL B : PALLADIUM

NOTE: Dimension “∗” does not include mold protrusion.

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER / PALLADIUM

PLATING

42/COPPER ALLOY

0.1g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

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