CYISM560BSXC 데이터 시트보기 (PDF) - Cypress Semiconductor
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CYISM560BSXC Datasheet PDF : 8 Pages
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SM560
Package Drawing and Dimensions
8 Lead (150 Mil) SOIC - S80-8lead (150-Mil) SOIC S8
PIN 1 ID
4
1
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
3. REFERENCE JEDEC MS-012
4. PACKAGE WEIGHT 0.07gms
5
8
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
0.189[4.800]
0.196[4.978]
SEATING PLANE
0.010[0.254] X 45°
0.016[0.406]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.004[0.102]
0°~8°
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85066-*C
Document #: 38-07020 Rev. *E
Page 7 of 8
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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