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SGM8544XS 데이터 시트보기 (PDF) - Shengbang Microelectronics Co, Ltd

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SGM8544XS
SGMICRO
Shengbang Microelectronics Co, Ltd SGMICRO
SGM8544XS Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
MODEL
SGM8541
SGM8542
SGM8544
PACKAGE/ORDERING INFORMATION
ORDER NUMBER
SGM8541XN5/TR
SGM8541XS/TR
SGM8542XS/TR
SGM8542XMS/TR
SGM8544XS/TR
SGM8544XTS
PACKAGE
DESCRIPTION
SOT23-5
SO-8
SO-8
MSOP-8
SO-16
TSSOP-16
PACKAGE
OPTION
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
MARKING
INFORMATION
8541
SGM8541XS
SGM8542XS
SGM8542XMS
SGM8544XS
SGM8544XTS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- ........................................... 7.5 V
Common-Mode Input Voltage
...........................................(–VS )– 0.5 V to (+VS) +0.5V
Storage Temperature Range.................. –65℃ to +150
Junction Temperature ............................................... 150
Operating Temperature Range ........... –55to +150
Package Thermal Resistance @ TA = 25
SOT23-5, θJA.............................................................. 190/W
SO-8, θJA......................................................................125/W
MSOP-8, θJA.............................................................. 216/W
SO-16, θJA..................................................................... 82/W
TSSOP-16, θJA............................................................ 105/W
Lead Temperature Range (Soldering 10 sec)
.....................................................260
ESD Susceptibility
HBM................................................................................4000V
MM....................................................................................400V
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
CAUTION
This integrated circuit can be damaged by ESD.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes could
cause the device not to meet its published
specifications.
SGM8541/8542/8544

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