SGM324 데이터 시트보기 (PDF) - Unspecified
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SGM324 Datasheet PDF : 18 Pages
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MODEL
SGM321
SGM358
SGM324
PACKAGE/ORDERING INFORMATION
ORDER NUMBER
SGM321YC5/TR
SGM321YN5/TR
SGM358YS/TR
SGM358YMS/TR
SGM358YP
SGM324YS/TR
SGM324YTS/TR
SGM324YS14/TR
SGM324YTS14/TR
PACKAGE
DESCRIPTION
SC70-5
SOT23-5
SO-8
MSOP-8
PDIP-8
SO-16
TSSOP-16
SO-14
TSSOP-14
PACKAGE
OPTION
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
Tube, 50
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
MARKING
INFORMATION
321
321
SGM358YS
SGM358YMS
SGM358YP
SGM324YS
SGM324YTS
SGM324YS14
SGM324YTS14
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- . . . . . . . . . . . . . . . . . . . . . 7.5 V
Common-Mode Input Voltage
. . . . . . . . . . . . . . . . . . . . (–VS) – 0.5 V to (+VS )+0.5V
Storage Temperature Range . . . . . . . . .–65℃ to +150℃
Junction Temperature . . . . . . . . . . . . . . . .. . . . . . . .160℃
Operating Temperature Range . . . . . . . –45℃ to +85℃
Package Thermal Resistance @ TA = 25℃
SC70-5, θJA................................................................ 333℃/W
SOT23-5, θJA.............................................................. 190℃/W
SO-8, θJA......................................................................125℃/W
MSOP-8, θJA.............................................................. 216℃/W
SO-16, θJA..................................................................... 82℃/W
TSSOP-16, θJA............................................................ 105℃/W
Lead Temperature Range (Soldering 10 sec)
.....................................................260℃
ESD Susceptibility
HBM................................................................................4000V
MM....................................................................................400V
CAUTION
This integrated circuit can be damaged by ESD.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes could
cause the device not to meet its published
specifications.
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
３
SGM321/358/324
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