SG7815AG-DESC 데이터 시트보기 (PDF) - Microsemi Corporation
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SG7815AG-DESC Datasheet PDF : 12 Pages
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Package Outline Dimensions (continued)
Package Outline Dimensions (continued)
E
V
P
Z
A
A1
D
O
D1
J
H
L
b
VIN GND VOUT
e
A2
Dim
MILLIMETERS
MIN
MAX
A
4.70
5.21
A1
0.89
1.14
A2
2.92
3.18
b
0.71
0.081
D
16.38
16.76
D1* 10.41
10.92
e
2.54 BSC
E*
10.41
10.67
H
0.50
L
12.70
O
13.39
13.64
P
3.56
3.81
J
0.10
V
5.13
5.38
Z
1.40 Typ
INCHES
MIN
MAX
0.185
0.205
0.035
0.045
0.115
0.125
0.027
0.032
0.645
0.660
0.410
0.430
0.100 BSC
0.410
0.420
0.020
0.500
0.527
0.537
0.140
0.150
0.004
0.202
0.212
0.055 Typ
*Excludes Weld Fillet Around Lid.
Note: Dimensions do not include protrusions; these shall not
exceed 0.155 mm (0.006″) on any side. Lead dimension shall
not include solder coverage.
Figure 11 · G/IG 3-Pin Hermetic TO-257
E3
D
A
L2
A1
3
1
h
A2
18
B1
E
L
8
13
e
B3
MILLIMETERS
Dim
MIN
MAX
INCHES
MIN MAX
D, E
8.64
9.14
0.340 0.360
E3
-
8.128
-
0.320
e
1.270 BSC
0.050 BSC
B1
0.635 Typ
0.025 Typ
L
1.02
1.52
0.040 0.060
A
1.626
2.286 0.064 0.090
h
1.016 Typ
0.040 Typ
A1
1.372
1.68
0.054 0.066
A2
-
1.168
-
0.046
L2
1.91
2.41
0.075 0.95
B3
0.203R
0.008R
Note: All exposed metalized area shall be gold plated
60 µ-inch minimum thickness over nickel plated unless
specified in purchase order. Lead dimension shall not include
solder coverage
Figure 12 · L 20-Pin Ceramic Leadless Chip Carrier
11
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