NCV8660 데이터 시트보기 (PDF) - ON Semiconductor
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NCV8660 Datasheet PDF : 14 Pages
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NCV8660
110
2.0
1.8
100
1.6
90
Power curve with PCB 1 oz cu
1.4
80
1.2
Theta JA curve
1.0
70
0.8
60
0.6
0.4
50
0.2
40
0
0
100 200 300 400 500 600 700
COPPER HEAT SPREADER AREA (mm2)
Figure 26. RqJA vs. PCB Copper Area (DPAK)
180
170
160
150
140
130
120
110
100
90
80
0
100
0.5
0.2
10 0.1
0.05
0.02
1
0.01
0.1 Single Pulse
1.3
Power curve with PCB 1 oz cu
1.2
1.1
1.0
0.9
Theta JA curve
0.8
100 200 300 400 500 600
COPPER HEAT SPREADER AREA (mm2)
Figure 28. RqJA vs. PCB Copper Area
(SOIC−8 Fused)
0.7
700
0.01
0.001
0.000001 0.00001
0.0001
Psi Tab−A
0.001
0.01
0.1
PULSE TIME (sec)
1
10
Figure 27. Transient Thermal Response (DPAK)
Cu Area = 645 mm2
100
1000
100 0.5
0.2
10
0.1
0.05
0.02
1 0.01
Single Pulse
0.1
0.01
0.001
0.000001 0.00001
Psi L−A
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
1
10
Figure 29. Transient Thermal Response (SOIC−8 Fused)
Cu Area = 645 mm2
100
1000
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