NCV8605 데이터 시트보기 (PDF) - ON Semiconductor

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NCV8605

500 mA, Low IGND, CMOS LDO Regulator with/without Enable and with Enhanced ESD Protection

ON Semiconductor 

NCV8605, NCV8606

Input bias current IADJ is typically less than 150 nA.

Choose R1 arbitrarily to minimize errors due to the bias

current and to minimize noise contribution to the output

voltage. Use Equation 2 to find the required value for R2.

Thermal

As power in the NCV8605/NCV8606 increases, it might

become necessary to provide some thermal relief. The

maximum power dissipation supported by the device is

dependent upon board design and layout. Mounting pad

configuration on the PCB, the board material, and the

ambient temperature affect the rate of junction temperature

rise for the part. When the NCV8605/NCV8606 has good

thermal conductivity through the PCB, the junction

temperature will be relatively low with high power

applications. The maximum dissipation the

NCV8605/NCV8606 can handle is given by:

ƪ ƫ TJ(MAX) * TA

PD(MAX) +

RQJA

(eq. 3)

Since TJ is not recommended to exceed 125C (TJ(MAX)),

then the NCV8605/NCV8606 soldered on 645 mm2, 1 oz

copper area, FR4 can dissipate up to 1.3 W when the ambient

temperature (TA) is 25C. See Figure 23 for RqJA versus

PCB area.

The power dissipated by the NCV8605/NCV8606 can be

calculated from the following equations:

ǒ Ǔ PD [ Vin IGND@IOUT ) IoutǒVin * VoutǓ (eq. 4)

or

PD(MAX) ) ǒVout

Vin(MAX) [

Iout ) IGND

IoutǓ

(eq. 5)

250

200

150

FR4 = 1.0 oz

100

FR4 = 2.0 oz

50

0

0

200

400

600

800

COPPER AREA (mm2)

Figure 23. Thermal Resistance vs. Copper Area

Hints

Vin and GND printed circuit board traces should be as

wide as possible. When the impedance of these traces is

high, there is a chance to pick up noise or cause the regulator

to malfunction. Place external components, especially the

output capacitor, as close as possible to the

NCV8605/NCV8606, and make traces as short as possible.

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