NCV8843(2006) 데이터 시트보기 (PDF) - ON Semiconductor

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NCV8843
(Rev.:2006)

1.5 A, 340 kHz, Buck Regulator with Synchronization Capability

ON Semiconductor 

NCV8843

PACKAGE DIMENSIONS

SOIC 16−LEAD WIDE BODY EXPOSED PAD

PW SUFFIX

CASE 751AG−01

ISSUE O

−U−

A

16

P

0.25 (0.010) M W M 1

9

B

8

−W−

PIN 1 I.D.

G 14 PL

TOP SIDE

M

R x 45_

DETAIL E

0.10 (0.004) T

D 16 PL

0.25 (0.010) M

C

−T−

K SEATING

PLANE

T U S WS

H

F

J

DETAIL E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION SHALL BE

0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION

AT MAXIMUM MATERIAL CONDITION.

6. 751R−01 OBSOLETE, NEW STANDARD 751R−02.

MILLIMETERS

INCHES

DIM MIN MAX MIN MAX

A 10.15 10.45 0.400 0.411

B 7.40 7.60 0.292 0.299

C 2.35 2.65 0.093 0.104

D 0.35 0.49 0.014 0.019

F 0.50 0.90 0.020 0.035

G

1.27 BSC

0.050 BSC

H 3.31 3.51 0.130 0.138

J 0.25 0.32 0.010 0.012

K 0.00 0.10 0.000 0.004

L 4.58 4.78 0.180 0.188

M 0_ 7_ 0_ 7_

P 10.05 10.55 0.395 0.415

R 0.25 0.75 0.010 0.029

1

EXPOSED PAD

16

8

L

9

SOLDERING FOOTPRINT*

.350

.175

.050

Exposed

Pad

BACK SIDE

.200

.07

4

CL

.18

8

CL

.376

.024

.145

SCALE 2:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

14

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