NCV8535(2010) 데이터 시트보기 (PDF) - ON Semiconductor

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NCV8535
(Rev.:2010)

Ultra High Accuracy, Low Iq, 500 mA Low Dropout Regulator with Enable

ON Semiconductor 

NCV8535

PIN FUNCTION DESCRIPTION

Fixed Version

Pin No. Pin Name

Description

1, 2

Vout

Regulated output voltage. Bypass to ground with Cout w 1.0 mF.

3

SENSE

For output voltage sensing, connect to Pins 1 and 2.

4

GND

Power Supply Ground

7

NR

Noise Reduction Pin. This is an optional pin used to further reduce noise.

8

SD

Shutdown pin. When not in use, this pin should be connected to the input pin.

9, 10

5, 6

Vin

Power Supply Input Voltage

NC

Not Connected

EPAD

EPAD

Exposed thermal pad should be connected to ground.

Adjustable Version

1, 2

Vout

3

Adj

4

GND

7

NR

8

SD

9, 10

Vin

5, 6

NC

EPAD

EPAD

Regulated output voltage. Bypass to ground with Cout w 1.0 mF.

Adjustable pin; reference voltage = 1.25 V.

Power Supply Ground

Noise Reduction Pin. This is an optional pin used to further reduce noise.

Shutdown pin. When not in use, this pin should be connected to the input pin.

Power Supply Input Voltage

Not Connected

Exposed thermal pad should be connected to ground.

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage

Vin

−0.3 to +16

V

Output Voltage

Vout

−0.3 to Vin +0.3 or 10 V*

V

Shutdown Pin Voltage

Vsh

−0.3 to +16

V

Junction Temperature Range

TJ

−40 to +150

°C

Storage Temperature Range

Tstg

−55 to +150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device series contains ESD protection and exceeds the following tests:

Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A114)

Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A115)

Charged Device Model (CDM) tested per EIA/JESD22−C101

*Which ever is less. Reverse bias protection feature valid only if Vout − Vin ≤ 7 V.

THERMAL CHARACTERISTICS

Test Conditions (Typical Value)

Characteristic

Min Pad Board (Note 1)

1, Pad Board (Note 1)

Unit

Junction−to−Air, qJA

215

66

°C/W

Junction−to−Pin, yJL2

55

17

°C/W

1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and

heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions

are under natural convection or zero air flow.

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