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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

NCV8184(2004) 데이터 시트보기 (PDF) - ON Semiconductor

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NCV8184 Datasheet PDF : 14 Pages
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NCV8184
PACKAGE THERMAL DATA
Parameter
SO−8 Package
Junction−to−Case top (Y−JT, YJT)
Junction−to−Pin 8 (Y−JL8, YJL8)
Junction−to−Ambient (RqJA, qJA)
DPAK 5−Pin Package
Junction−to−Board (Y−JB, YJB)
Junction−to−Pin 3 (tab) (Y−JL3, YJL3)
Junction−to−Ambient (RqJA, qJA)
Test Conditions
Typical Value
Min−Pad Board (Figure 24)
1.0 in Pad Board (Figure 25)
39
32
63
58
121
0.5 in2 Spreader Board (Figure 26)
98
1.0 in2 Spreader Board (Figure 27)
15
15
16
16
100
69
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Figure 24. 2.0 oz. copper, 40 mil traces
Figure 25. 1.0 oz. copper,
approx. 1/8 in2 per lead, 1.0 in2 total
Figure 26. 1.0 oz. copper, 0.3 in2 drain pad,
0.5 in2 including traces
Figure 27. 2.0 oz. copper, 0.5 in2 drain
pad, 1.0 in2 including traces
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