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NCP690(2009) 데이터 시트보기 (PDF) - ON Semiconductor

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NCP690 Datasheet PDF : 14 Pages
First Prev 11 12 13 14
NCP690, NCP691, NCP692
divider network as shown on Figure 4. The output voltage
and resistors should be chosen using Equations 1 and 2.
ǒ Ǔ VOUT + 1.250
1
)
R1
R2
) (IADJ @ R1)
(eq. 1)
R2
^
R1
1
VOUT
1.25
*
1
(eq. 2)
Input bias current IADJ is typically less than 210 nA.
Choose R1 arbitrarily to minimize errors due to the bias
current and to minimize noise contribution to the output
voltage. Use Equation 2 to find the required value for R2.
Thermal Characteristics
As power dissipated in the NCP690 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. When the NCP690 has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power applications. The
maximum dissipation the NCP690 can handle is given by:
PD(MAX)
+
[TJ(MAX) *
RqJA
TA]
(eq. 3)
Since TJ is not recommended to exceed 125°C (TJ(MAX)),
then the NCP690 can dissipate up to 1 W when the ambient
temperature (TA) is 25°C.
The power dissipated by the NCP690 can be calculated
from the following equations:
PD [ VIN(IGND@IOUT) ) IOUT(VIN * VOUT) (eq. 4)
or
VIN(MAX)
[
PD(MAX) ) (VOUT
IOUT ) IGND
IOUT)
(eq. 5)
250
200
150
FR4 1.0 oz
100
FR4 2.0 oz
50
0
0
200
400
600
800
COPPER AREA (mm2)
Figure 32. Thermal Resistance vs. Copper Area
Hints
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCP690, and
make traces as short as possible.
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