NCP508
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1
Vin
Positive power supply input voltage
2
GND
Power supply ground
3
Enable
This input is used to place the device into low−power stand by. When this input is pulled low, the
device is disabled. If this function is not used, Enable should be connected to Vin.
4
N/C
Not connected pin
5
Vout
Regulated output voltage
MAXIMUM RATING
Rating
Symbol
Value
Unit
Input Voltage
Enable Voltage
Output Voltage
Power Dissipation and Thermal Characteristics (SC−88A)
Power Dissipation
Thermal Resistance, Junction−to−Ambient (Note 4)
Vin(max)
Enable
Vout
PD
RqJA
13.0
−0.3 to Vin(max) + 0.3
−0.3 to Vin(max) + 0.3
Internally Limited
200
V
V
V
W
°C/W
Power Dissipation and Thermal Characteristics (WDFN6)
Power Dissipation
Thermal Resistance, Junction−to−Ambient (Note 4)
PD
RqJA
Internally Limited
313
W
°C/W
Maximum Junction Temperature
TJ
+125
°C
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Lead Soldering Temperature @ 260°C
Tsolder
10
sec
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015.
Machine Model Method 200 V
2. Latch up Capability (85°C) $ 100 mA DC with trigger voltage
3. Maximum package power dissipation limits must be observed.
TJ(max) * TA
PD +
RqJA
4. RqJA on a 30 x 30 mm PCB Cu thickness 1 oz; TA = 25°C.
RECOMMENDED OPERATING CONDITIONS
Rating
Maximum Operating Input Voltage
Symbol
Vin
Max
Unit
7.0
V
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