NCP4686(2011) 데이터 시트보기 (PDF) - ON Semiconductor
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NCP4686 Datasheet PDF : 17 Pages
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NCP4686
VIN
VOUT VIN
VOUT
Vref
Vref
Current Limit
CE
CE
GND
Current Limit
GND
NCP4686Hxxxx
NCP4686Dxxxx
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN6
Pin No.
SC−70
Pin No.
SOT23
Pin Name
Description
6
4
5
VOUT
Output pin
2
3
2
GND
Ground
3
1
3
CE
Chip enable pin (Active “H”)
4
5
1
VIN
Input pin
1
2
4
NC
No connection
5
−
−
NC
No connection
*Please refer to package dimensions section on Page 15 on this data sheet for pin numbers associated with different package.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
Output Voltage
Chip Enable Input
Output Current
Power Dissipation XDFN1212
Power Dissipation SC−70
VIN
VOUT
VCE
IOUT
PD
4.0
V
−0.3 to VIN + 0.3
V
−0.3 to 4.0
V
500
mA
400
mW
380
Power Dissipation SOT23
420
Junction Temperature
TJ
−40 to 150
°C
Storage Temperature
TSTG
−55 to 125
°C
Operating Ambient Temperature Range
TA
−40 to +85
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
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