NCP1288(2010) 데이터 시트보기 (PDF) - ON Semiconductor
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NCP1288 Datasheet PDF : 32 Pages
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NCP1288
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Supply Pin (pin 6) (Note 2)
Voltage range
Current range
VCCMAX
–0.3 to 28
V
ICCMAX
$30
mA
High Voltage Pin (pin 8) (Note 2)
Voltage range
Current range
Driver Pin (pin 5) (Note 2)
Voltage range
Current range
All other pins (Note 2)
Voltage range
Current range
Thermal Resistance
Junction−to−Air, low conductivity PCB (Note 3)
Junction−to−Air, medium conductivity PCB (Note 4)
Junction−to−Air, high conductivity PCB (Note 5)
VHVMAX
IHVMAX
–0.3 to 500
$20
VDRVMAX
IDRVMAX
–0.3 to 20
$1000
VMAX
IMAX
RqJA
–0.3 to 10
$10
162
147
125
V
mA
V
mA
V
mA
°C/W
Temperature Range
Operating Junction Temperature
Storage Temperature Range
ESD Capability (Note 1)
Human Body Model (HBM) Model (All pins except HV)
Machine Model (MM)
°C
TJMAX
−40 to +150
TSTRGMAX −60 to +150
V
2000
190
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per JEDEC standard JESD22, Method A114E
Machine Model Method 200 V per JEDEC standard JESD22, Method A115A
2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78
3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2 of 1 oz copper traces and heat spreading area. As specified
for a JEDEC 51−1 conductivity test PCB. Test conditions were under natural convection or zero air flow.
4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51−2 conductivity test PCB. Test conditions were under natural convection or zero air flow.
5. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm2 of 1 oz copper traces and heat spreading area. As specified
for a JEDEC 51−3 conductivity test PCB. Test conditions were under natural convection or zero air flow.
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