MPVZ7025GP 데이터 시트보기 (PDF) - Freescale Semiconductor
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MPVZ7025GP
Freescale Semiconductor
MPVZ7025GP Datasheet PDF : 10 Pages
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Pressure
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.006 (0.15) C A B
A
E
5
4
D
e
e/2
GAGE
PLANE
.014 (0.35) θ
L
A1
DETAIL G
8
F
B
N
P
1
E1
8X
DETAIL G
8X b
0.004 (0.1) M C A B
STYLE 1:
PIN 1. GND
2. +Vout
3. Vs
4. -Vout
5. N/C
6. N/C
7. N/C
8. N/C
STYLE 2:
PIN 1. N/C
2. Vs
3. GND
4. Vout
5. N/C
6. N/C
7. N/C
8. N/C
∅T
A
M
0.004 (0.1)
K
C
SEATING
PLANE
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.370 0.390 9.39 9.91
A1 0.002 0.010 0.05 0.25
b 0.038 0.042 0.96 1.07
D 0.465 0.485 11.81 12.32
E 0.680 0.700 17.27 17.78
E1 0.465 0.485 11.81 12.32
e
0.100 BSC
2.54 BSC
F 0.240 0.260 6.10 6.60
K 0.115 0.135 2.92 3.43
L 0.040 0.060 1.02 1.52
M 0.270 0.290 6.86 7.37
N 0.160 0.180 4.06 4.57
P 0.009 0.011 0.23 0.28
T 0.110 0.130 2.79 3.30
θ
0˚
7˚
0˚
7˚
CASE 1351-01
ISSUE O
SMALL OUTLINE PACKAGE
MPXV7025
8
Sensors
Freescale Semiconductor
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