MPVZ7025GC6T1 데이터 시트보기 (PDF) - Freescale Semiconductor

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MPVZ7025GC6T1

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluorosilicone gel

which protects the die from harsh media. The pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table:

Part Number

MPXV7025GC6U/C6T1, MPVZ7025GC6U/T1

MPXV7025GP, MPVZ7025GP

MPXV7025DP, MPVZ7025DP

MPVZ7025G6U/T1

Case Type

482A

1369

1351

482

Pressure (P1)

Side Identifier

Side with Port Attached

Side with Port Attached

Side with Part Marking

Side with Part Marking

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 4. Small Outline Package Footprint

MPXV7025

6

Sensors

Freescale Semiconductor

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