MPVZ5150GC7U(2006) 데이터 시트보기 (PDF) - Freescale Semiconductor

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MPVZ5150GC7U
(Rev.:2006)

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluorocarbon gel

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using Table 3

below.

TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

MPVZ5150GC6T1

MPVZ5150GC7U

Part Number

Case Type

482A

482C

Pressure (P1) Side Identifier

Top with Port Attached

Top with Port Attached

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

between the board and the package. With the correct

shorting between solder.

Figure 5. Small Outline Package Footprint

Sensors

Freescale Semiconductor

MPVZ5150

5

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