MP3H6115AC6T1(2006) 데이터 시트보기 (PDF) - Freescale Semiconductor
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MP3H6115AC6T1
(Rev.:2006)
(Rev.:2006)
Freescale Semiconductor
MP3H6115AC6T1 Datasheet PDF : 12 Pages
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Fluoro Silicone
+3 V
Gel Die Coat
Stainless Steel
Die
Cap
P1
Wire Bond
Leadframe
Thermoplastic
Case
VS Pin 2
MP3H6115A
100 nF
VOUT Pin 4
to
GND Pin 3
47 pF
51 K
Absolute Elelment
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP (not to scale)
GND
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
3.0
2.75 Transfer Function:
Max
2.5 VOUT = VS x (.009xP–.095) ± Error
2.25
VS = 3.0 VDC
Temp = 0 to 85°C
2.0
1.75
Typ
1.5
1.25
1.0
0.75
0.5
Min
0.25
0
Pressure (Reference to Sealed Vacuum) in kPa
Figure 4. Output versus Pressure Differential
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MP3H6115A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
MP3H6115A
4
Sensors
Freescale Semiconductor
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