MNA145CN101MK 데이터 시트보기 (PDF) - ROHM Semiconductor

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MNA145CN101MK

Multi-layer ceramic chip capacitor networks

ROHM Semiconductor 

Ceramic capacitors

MNA14

Class 2 (High dielectric constant)

Temperature characteristics

Item

Operating temperature

CN (X7R)

−55°C ~ +125°C

Test methods/conditions

(based on JIS C 5102)

Nominal capacitance (C)

Dissipation factor (tanδ)

Insulation resistance (IR)

Withstanding voltage

Temperature characteristics

Must be within the specified tolerance range.

2.5% or less

(when rated voltage is 16V : 3.5% or less)

10,000MΩ or 500MΩ⋅µF, whichever is smaller

The insulation must not be damaged.

Within ± 15%

Based on paragraph 7.8

Measured at room temperature and standard humidity.

Measurement frequency: 1 ± 0.1 kHz

Measurement voltage : 0.1 ± 0.2 Vrms.

Based on paragraph 7.6

Measurement is made after rated voltage

is applied for 60 ± 5s.

Based on paragraph 7.1

Apply 250% of the rated voltage

for 1 to 5s then measure.

The temperature coefficients in paragraph 7.12,

table 8, condition B, are based on measurements

carried out at 20°C, with no voltage applied.

Terminal adherence

No peeling or sign of peeling on terminal.

Based on paragraph 8.11.2.

Apply 5N for 10 ± 1s

in the direction indicated

by the arrow.

Pressure (5N)

Test board

Capacitor

Resistance

to vibration

Appearance

Rate of capacitance change

Dissipation factor (tanδ)

There must be no mechanical damage.

Must be within initial tolerance.

Must satisfy initial specified value.

Chip is mounted to a board in the

manner shown on the right, subjected

to vibration (type A in paragraph 8.2),

and measured 48 ± 4 hrs. later.

Board

Solderability

At least 3/4 of the surface of the two terminals must be covered with new solder.

Based on paragraph 8.13

Soldering temperature: 235 ± 5°C

Soldering time

: 2 ± 0.5s

Resistance

to soldering

heat

Appearance

Rate of capacitance change

Dissipation factor (tanδ)

Insulation resistance

Withstanding voltage

There must be no mechanical damage.

Within ± 5.0%

Must satisfy initial specified value.

10,000MΩ or 500MΩ⋅µF, whichever is smaller

The insulation must not be damaged.

Based on paragraph 8.14.

Soldering temperature: 260 ± 5°C

Soldering time

Preheating

: 5 ± 0.5s

: 150 ± 10°C for

1 to 2 min.

Appearance

Temperature

cycling

Rate of capacitance change

Dissipation factor (tanδ)

There must be no mechanical damage.

Within ± 7.5%

Must satisfy initial specified value.

Based on paragraph 9.3

Number of cycles : 5

Capacitance measured after 48 ± 4 hrs.

Insulation resistance

10,000MΩ or 500MΩ⋅µF, whichever is smaller

Appearance

Humidity load

test

Rate of capacitance change

Dissipation factor (tanδ)

Insulation resistance

Appearance

High-

temperature

load test

Rate of capacitance change

Dissipation factor (tanδ)

Insulation resistance

There must be no mechanical damage.

Within ± 12.5%

5.0% or less

500MΩ or 25MΩ⋅µF, whichever is smaller

There must be no mechanical damage.

Within ± 10.0%

5.0% or less

1,000MΩ or 50MΩ⋅µF, whichever is smaller

Based on paragraph 9.9

Test temperature : 40 ± 2°C

Relative humidity : 90% to 95%

Applied voltage : rated voltage

Test time

: 500 to 524 hrs.

Capacitance measured after 48 ± 4 hrs.

Based on paragraph 9.10

Test temperature : Max. operating temp.

Applied voltage : rated voltage × 200%

Test time

: 1,000 to 1,048 hrs.

Capacitance measured after 48 ± 4 hrs.

∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.

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