MNA142CN101KK 데이터 시트보기 (PDF) - ROHM Semiconductor

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MNA142CN101KK

Multi-layer ceramic chip capacitor networks

ROHM Semiconductor 

Ceramic capacitors

!Characteristics

Class 1 (For thermal compensation)

Temperature characteristics

Item

Operating temperature

Nominal capacitance (C)

Dissipation factor (tanδ)

Insulation resistance (IR)

Withstanding voltage

Temperature characteristics

Terminal adherence

Resistance

to vibration

Appearance

Rate of capacitance change

Dissipation factor (tanδ)

Solderability

Appearance

Resistance

to soldering

heat

Rate of capacitance change

Dissipation factor (tanδ)

Insulation resistance

Withstanding voltage

Appearance

Temperature Rate of capacitance change

cycling

Dissipation factor (Tanδ)

Insulation resistance

Appearance

Rate of capacitance change

Humidity load

test

Dissipation factor (tanδ)

Insulation resistance

High-

temperature

load test

Appearance

Rate of capacitance change

Dissipation factor (tanδ)

Insulation resistance

A (C0G)

−55°C ~ +125°C

Must be within the specified tolerance range.

100 / (400 + 20C)% or less: Less than 30 pF

0.1% or less : 30 pF or larger

10,000MΩ or 500MΩ⋅µF, whichever is smaller

The insulation must not be damaged.

Within 0 ± 30ppm / °C

No detachment or signs of detachment.

There must be no mechanical damage.

Must be within initial tolerance.

Must satisfy initial specified value.

At least 3/4 of the surface of the two terminals

must be covered with new solder.

There must be no mechanical damage.

± 2.5% or ± 0.25 pF, whichever is larger

Must satisfy initial specified value.

10,000MΩ or 500MΩ⋅µF, whichever is smaller

The insulation must not be damaged.

There must be no mechanical damage.

± 2.5% or ± 0.25 pF, whichever is larger

Must satisfy initial specified value.

10,000MΩ or 500MΩ⋅µF, whichever is smaller

There must be no mechanical damage.

± 7.5% or ± 0.75 pF, whichever is larger

0.5% or less

500MΩ or 25MΩ⋅µF, whichever is smaller

There must be no mechanical damage.

± 3.0% or ± 0.3 pF, whichever is larger

0.3% or less

10,000MΩ or 50MΩ⋅µF, whichever is smaller

MNA14

Test methods / conditions

(based on JIS C 5102)

Based on paragraph 7.8 and paragraph 9,

Measured at room temperature and standard humidity.

Measurement frequency : 1 ± 0.1MHz

Measurement voltage : 1 ± 0.1Vrms.

Based on paragraph 7.6.

Measurement is made after rated voltage is

applied for 60 ± 5s.

Based on paragraph 7.1.

Apply 300% of the rated voltage for 1 to 5s

then measure.

The temperature coefficients in table 12, paragraph

7.12 are calculated at 20°C and high temperature.

Based on paragraph 8.11.2.

Apply 5N for 10 ± 1s

in the direction

indicated by the arrow.

Pressure (5N)

Test board

Capacitor

Chip is mounted to a board in the manner

shown on the right, subjected to vibration

(type A in paragraph 8.2), and

measured 24 ± 2 hours later.

Board

Based on paragraph 8.13,

Soldering temperature : 235 ± 5°C

Soldering time

: 2 ± 0.5s

Based on paragraph 8.14.

Soldering temperature : 260 ± 5°C

Soldering time

: 5 ± 0.5s

Preheating

: 150 ± 10°C for 1 to 2 min.

Based on paragraph 9.3,

Number of cycles : 5

Capacitance measured after 24 ± 2 hrs.

Based on paragraph 9.9,

Test temperature : 40 ± 2°C

Relative humidity : 90% to 95%

Applied voltage : rated voltage

Test time

: 500 to 524 hrs.

Capacitance measured after 24 ± 2 hrs.

Based on paragraph 9.10,

Test temperature : Max. operating temp.

Applied voltage : rated voltage × 200%

Test time

: 1,000 to 1,048 hrs.

Capacitance measured after 24 ± 2 hrs.

∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.

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