MM74HC32 데이터 시트보기 (PDF) - Fairchild Semiconductor
부품명
상세내역
일치하는 목록
MM74HC32 Datasheet PDF : 9 Pages
| |||
Physical Dimensions
8.75
8.50
7.62
14
6.00
A
8
B
4.00
3.80
0.65
5.60
PIN ONE
INDICATOR
1
1.27
(0.33)
7
0.51
0.35
1.70
1.27
LAND PATTERN RECOMMENDATION
0.25 M C B A
1.75 MAX
1.50
1.25
R0.10
R0.10
8°
0°
SEE DETAIL A
0.25
0.10 C
0.10 C
0.25
0.19
NOTES: UNLESS OTHERWISE SPECIFIED
0.50
0.25
A) THIS PACKAGE CONFORMS TO JEDEC
X 45°
MS-012, VARIATION AB, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
GAGE PLANE FLASH OR BURRS.
D) LANDPATTERN STANDARD:
0.36
SOIC127P600X145-14M
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
0.90
0.50
(1.04)
SEATING PLANE
DETAIL A
SCALE: 20:1
Figure 1. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1983 Fairchild Semiconductor Corporation
MM74HC32 Rev. 1.3.0
5
www.fairchildsemi.com
Share Link: 