MLL14KESD51C 데이터 시트보기 (PDF) - Microsemi Corporation

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MLL14KESD51C

SURFACE MOUNT

Microsemi Corporation 

SCOTTSDALE DIVISION

MLL14KESD5.0 thru MLL14KESD170A

SURFACE MOUNT TVS

DESCRIPTION

These surface mount Transient Voltage Suppressor (TVS) devices feature

the ability to clamp dangerous high voltage short-term transients such as

produced by direct or radiated electro-static discharge phenomena before

entering sensitive component regions of a circuit design. They are small

economical TVSs targeted primarily for short term transients below a few

microseconds while still achieving significant peak-pulse-power capability

as seen in Figure 1.

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

APPEARANCE

DO-213AB

FEATURES

• Excellent protection in clamping direct ESD level

transients in excess of 40,000 V per MIL-STD-750,

Method 1020 (approx. 150 ns exponential wave)

• Absorbs ESD level transients of 14,000 Watts per

MIL-STD-750, Method 1020 (approximately 150 ns

exponential wave, or one microsecond transients

up to 4000 watts. See Figure #1 and #2 for overall

transient Peak Pulse Power.

• Clamps Transients in less than 100 picoseconds

• Working Stand-off Voltage range of 5V to 170V

• Hermetic DO-213AB package. Also available in

axial-leaded DO-41package (see separate data

sheet for 14KESD5.0 series)

APPLICATIONS / BENEFITS

• Protects Sensitive circuits from short duration fast

rise time transients such as Electrostatic Discharge

(ESD) or Electrical Fast Transients (EFT)

• Minimal capacitance (See Figure #3)

• Small surface-mount footprint for high density

mounting

• Bidirectional features available by adding a “C” or

“CA” suffix to part number

MAXIMUM RATINGS

• 4000 Watts for One Microsecond Square Wave or

14,000 watts per ESD Wave form of MIL-STD-750,

method 1020.

• See Surge Rating curve in Figures #1 and 2.

• Operating and storage temperature –65oC to 175oC

• Thermal Resistance: 40 ºC/W junction to end cap, or

120ºC/W junction to ambient when mounted on FR4

PC board (1 oz Cu) with recommended footprint (see

last page)

• Steady-State Power: 1.50 watts at TEC < 115oC, or

1.25 watts at TA = 25ºC when mounted on FR4 PC

board and recommended footprint as described for

thermal resistance (also see Figure 1)

• Derate at 22.8 W/oC above 25oC for PPP (1µs) and at

15 mW/oC above 75oC for dc power.

• Forward Surge Current 500 amps for 1µs at TL =

25oC (rise time > 100 ns).

MECHANICAL AND PACKAGING

• CASE: Hermetically sealed DO-213AB glass MELF

package

• TERMINALS: End caps, tin-lead plated solderable

per MIL-STD-750, method 2026

• POLARITY: Cathode indicated by band.

• MARKING: Cathode band only

• TAPE & REEL optional: Standard per EIA-481-B

with 12 mm tape, 1500 per 7 inch reel or 5000 per

13 inch reel (add “TR” suffix to part number)

• WEIGHT: 0.05 grams

• See package dimensions on last page

Copyright  2002

10-03-2003 REV A

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

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