HI-5701/883 데이터 시트보기 (PDF) - Intersil

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HI-5701/883

6-Bit, 30 MSPS Flash A/D Converter

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Die Characteristics

DIE DIMENSIONS:

2220µm x 3320µm x 19 ± 1mils

METALLIZATION:

Type: Si - Al

Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 8kÅ ± 1kÅ

DIE ATTACH:

Material: Gold Silicon Eutectic Alloy

Temperature: Ceramic DIP - 460oC (Max)

WORST CASE CURRENT DENSITY:

3.05 x 104 A/cm2

Metallization Mask Layout

HI-5701/883

HI-5701/883

VSS

CE2

CE1

1/2R

D2

D1

D0

VDD

Spec Number 512031

6-6

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