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MC74VHC1GT32 데이터 시트보기 (PDF) - ON Semiconductor

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MC74VHC1GT32
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC74VHC1GT32 Datasheet PDF : 14 Pages
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MC74VHC1G32, MC74VHC1GT32
PACKAGE DIMENSIONS
SC74A
CASE 318BQ
ISSUE B
5X b
0.20 C A B
5
4
E1
E
123
B
e
A
D
TOP VIEW
A
M
0.05
A1
L
DETAIL A
DETAIL A
SIDE VIEW
C
SEATING
PLANE
c END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
MILLIMETERS
DIM MIN MAX
A 0.90 1.10
A1 0.01 0.10
b 0.25 0.50
c 0.10 0.26
D 2.85 3.15
E 2.50 3.00
E1 1.35 1.65
e
0.95 BSC
L 0.20 0.60
M
0 _ 10 _
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
9

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