MC74HCT08A 데이터 시트보기 (PDF) - ON Semiconductor
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MC74HCT08A Datasheet PDF : 7 Pages
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MC74HCT08A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
Vin DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
Vout DC Output Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
Iin
DC Input Current, per Pin
±20
mA
Iout DC Output Current, per Pin
±25
mA
ICC DC Supply Current, VCC and GND Pins
±50
mA
PD Power Dissipation in Still Air,
Plastic DIP†
750
mW
SOIC Package†
500
TSSOP Package†
450
Tstg Storage Temperature
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
°C
Plastic DIP, SOIC or TSSOP Package
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating − Plastic DIP: − 10 mW/°C from 65°C to 125°C
SOIC Package: − 7 mW/°C from 65°C to 125°C
TSSOP Package: − 6.1 mW/°C from 65°C to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Vin, Vout
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage
(Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf Input Rise and Fall Time
(Figure 3)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
Min
Max Unit
2.0
6.0
V
0
VCC
V
−55
+125
°C
0
1000
ns
0
500
0
400
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