MC74HC4067A(2013) 데이터 시트보기 (PDF) - ON Semiconductor
부품명
상세내역
일치하는 목록
MC74HC4067A Datasheet PDF : 12 Pages
| |||
MC74HC4067A
PACKAGE DIMENSIONS
SOIC−24 WB
CASE 751E−04
ISSUE F
0.25 C
24
E
1
PIN 1
INDICATOR
A
A1
NOTE 5
D
TOP VIEW
e
SIDE VIEW
A
H
B
13
E1
12
LC
DETAIL A
24X b
0.25 M C A S B S
NOTE 3
h
x 45 _
M
C
SEATING
PLANE
c
NOTE 3
DETAIL A
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b AND c APPLY TO THE FLAT SEC-
TION OF THE LEAD AND ARE MEASURED
BETWEEN 0.10 AND 0.25 FROM THE LEAD TIP.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 mm PER SIDE. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 PER SIDE. DIMENSIONS D AND E1 ARE
DETERMINED AT DATUM H.
5. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.13 0.29
b 0.35 0.49
c 0.23 0.32
D 15.25 15.54
E
10.30 BSC
E1 7.40 7.60
e
1.27 BSC
h 0.25 0.75
L 0.41 0.90
M
0_ 8_
RECOMMENDED
SOLDERING FOOTPRINT*
24X
0.52
24X
1.62
11.00
1
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
Share Link: 